BM5016S-0340

常州富鸿达电子有限公司成立于2010年,生产蜂鸣器,喇叭,报警器,咪头等电声器件,是一家集研发、生产、销售一体的企业。
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1. Document revision history

Modification time

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2.Technical Parameter

Measuring condition

Part shall be measured under a condition (Temperature: 5~35, Humidity: 45%~85%R.H., Atmospheric pressure: 860~1060hPa) unless the standard condition (Temperature: 25±3, Humidity: 60±10%R.H. Atmospheric pressure: 860~1060hPa) is regulated to measure.

 

1

Rated Voltage

3Vo-p

2

Operating Voltage

2~4Vo-p

3

Rated Current

Max.100MA,4000Hz 50% duty Square Wave3Vo-p

4

SoundOutput at 10cm

Min.75dB,at4000Hz 50% duty Square Wave3Vo-p

5

Coil Resistance

12±3Ω

6

Resonant Frequency

4000Hz

7

Operating Temperature

-20℃ ~ 70

8

Store Temperature

-40℃ ~ 85

9

NetWeight

Approx0.1g

10

RoHS

Yes

3.Dimensions

Unit: mm

 

 

*Unit: mm; Tolerance:±0.3mm Except Specified

*Housing Material:Black LCP  Top(Stainless steel)

*Terminal plate: 3 soldering pads, tin Plating Brass

 

 

 

4.Electrical And Acoustical Measuring Condition

Recommended Driving Circuit

Resonant frequency, 1/2 duty cycle. Square wave.

Signal amplitude should be large enough tosaturate

the transistor.

RecommendedSetting

 

 

5.Frequency Response

6.Surface mounting condition

6.1Reflow soldering

Recommendable reflow soldering condition is as follows.

Note: (1)In automated mounting of the SMD sound transducers on PCB, any bending, expanding

and pulling forces or shocks against the SMD sound transducers shall be kept minimum

to prevent them from electrical failures and mechanical damages of the devices.

(2) In the reflow soldering, too high soldering temperatures and too large temperature

      Gradient such as rapid heating or cooling may cause electrical failures and mechanical

damages of the devices.

 

6.2  Recommended Soldering pattern

 

 

          

 

 

7.Reliability Test

After any following tests thepart shall meet specifications without any degradation in

appearance and performance except SPL. SPLshall not deviate more than -10 dB

from the initial value

7.1  Ordinary Temperature Life Test

The part shall be subjected to96 hours at 25±10. Inputratedvoltage

Resonant frequency, 1/2 duty Square wave.

7.2  High Temperature Test

The part shall be capable of with standing a storage temperature of 85 for96 hours.

7.3  Low Temperature Test 

The part shall be capable of with standing a storage temperature of-40 for96 hours.

7.4  Humidity Test

Temperature: 40℃ ±3Relative Humidity:90%~95% Duration: 48 hours

and expose to room temperature for 6 hours

7.5  Temperature Shock Test

Temperature:60/1hour25/3hours-20/1hour25/3hours (1cycle)

Total cycle: 10 cycles

7.6  Drop Test

Standard Packaging From 75cm(Drop on hard wood or board of 5cm thick,

three sides, six plain.)

7.7  Vibration Test

Vibration:1000cycles /min. Amplitude:1.5mm, Duration: 1 hour in each 3 axes

7.8  Reflow Test

Userecommendable reflow soldering condition (as shown in 6.1)

(1)No abnormality should be found afterreflow

(2)Good soldering to meet soldering requirements

 

 

Note:

As this product is not protected from foreign material entering, please make sure that any foreign materials (e.g. magnetic powder, washing solvent, flux, corrosive gas) do not enter this product in your production processes. The functional degradation (e.g. SPL down) may occur if foreign material enter it.

 

 

8. Packing

Packaging Requirements

Tape packaging: see drawing requirements for details

1.Carton No:F6-X-011,Outer box size36*19*36cm(5Disk loading)

2.Inner Box No:F6-H-008,Inner box size76*45.5cm

3.Load No:F6-Z-028,Upper Seal Tape Material:F6-S-001   3000PCS/Disc

4.Each carrier plate uses a largePEPut the bags into the inner box;PEBag number:F6-D-014

Marks requirements

Inner box:

By Customer Order

Outer box:

By Customer Order

 

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