丹姆德

119-5020-04


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  • BM5020S.jpg

119-5020-04

零件应在一个条件下(温度:5~35℃,湿度:45%~85%R.H.,大气压:860~1060hPa)进行测量,除非调节标准条件(温度:25±3℃,湿度为60±10%R.H.大气压:860~1060hPa)来进行测量。


所属分类: SMD电磁无源蜂鸣器
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关键词:蜂鸣器 | 喇叭| 物化片

产品描述

1. Document revision history

修改时间

版本

修改页次

修改内容

确认人

 

2. Technical Parameter

Measuring condition

Part shall be measured under a condition (Temperature: 535, Humidity: 45%85%R.H., Atmospheric pressure: 860 1060hPa) unless the standard condition (Temperature: 25±3, Humidity: 60±10%R.H. Atmospheric pressure: 860 1060hPa) is regulated to measure.

 

1

Rated Voltage

3Vo-p

2

Operating Voltage

24Vo-p

3

Rated Current

Max.100mA ,at 4000Hz 50% duty Square Wave 3Vo-p

4

Sound Output at 10cm

Min. 78dB,at 4000Hz 50% duty Square Wave 3Vo-p

5

Coil Resistance

12±3Ω

6

Resonant Frequency

4000Hz

7

Operating Temperature

-30℃~+70

8

Store Temperature

-40℃~+85

9

Net Weight

Approx 0.12g

10

RoHS

Yes

3. Dimensions

Unit: mm

*Unit: mm; Tolerance: ±0.3mm Except Specified

*Housing Material: Black LCP

*Terminal plate: 3soldering pads, tin Plating Brass

 

4. Electrical And Acoustical Measuring Condition

Recommended Driving Circuit

Resonant frequency, 1/2 duty cycle. Square wave.

Signal amplitude should be large enough tosaturate

the transistor.

Recommended Setting

 

5. Frequency Response

3Vo-p 50% duty Square wave,10cm

6. Surface mounting condition

6.1 Reflow soldering

Recommendable reflow soldering condition is as follows.

Note: (1) In automated mounting of the SMD sound transducers on PCB, any bending, expanding

and pulling forces or shocks against the SMD sound transducers shall be kept minimum

to prevent them from electrical failures and mechanical damages of the devices.

(2) In the reflow soldering, too high soldering temperatures and too large temperature

      Gradient such as rapid heating or cooling may cause electrical failures and mechanical

damages of the devices.

6.2  Recommended Soldering pattern

 

 

7. Reliability Test

After any following tests the part shall meet specifications without any degradation in

appearance and performance except SPL. SPL shall not deviate more than -10 dB

from the initial value

7.1  Ordinary Temperature Life Test

The part shall be subjected to 96 hours at 25±10. Input rated voltage

Resonant frequency, 1/2 duty Square wave.

7.2  High Temperature Test

The part shall be capable of with standing a storage temperature of +85 for 96 hours.

7.3  Low Temperature Test 

The part shall be capable of with standing a storage temperature of -40 for 96 hours.

7.4  Humidity Test

Temperature:+40℃±3℃   Relative Humidity:90%95% Duration: 48 hours

and expose to room temperature for 6 hours

7.5  Temperature Shock Test

Temperature:60/1hour25/3hours-20/1hour25/3hours (1cycle)

Total cycle: 10 cycles

7.6  Drop Test

Standard Packaging From 75cm(Drop on hard wood or board of 5cm thick,

three sides, six plain.)

7.7  Vibration Test

Vibration:1000cycles /min. Amplitude:1.5mm, Duration: 1 hour in each 3 axes

7.8  Reflow Test

Use recommendable reflow soldering condition (as shown in 5.1)

(1) No abnormality should be found after reflow

(2) Good soldering to meet soldering requirements

 

 

Note:

As this product is not protected from foreign material entering, please make sure that any foreign materials (e.g. magnetic powder, washing solvent, flux, corrosive gas) do not enter this product in your production processes. The functional degradation (e.g. SPL down) may occur if foreign material enter it.

 

   

8.  Packing

包装要求

编带包装:详见图纸要求

1.外箱料号:F6-X-011,外箱尺寸36*19*36cm(5盘装)

2.内箱料号:F6-H-008,内箱尺寸76*45.5cm

3.载带料号:F6-Z-028,上封带料号:F6-S-001   3000PCS/

4.每个载盘用一个大PE袋装好再放入内箱;PE袋料号:F6-D-014

唛头要求

内盒:

按客户订单

外箱:

按客户订单

 

 

 

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