Part shall be measured under a condition (Temperature: 5～35℃, Humidity: 45% ～ 85%R.H., Atmospheric pressure: 860 ～ 1060hPa) unless the standard condition (Temperature: 25±3℃, Humidity: 60±10%R.H. Atmospheric pressure: 860 ～1060hPa) is regulated to measure.
|2||Operating Voltage||1～20 Vp-p|
|3||Rated Current||Max.3mA ,at 4.1KHz 50% duty Square Wave 3Vp-p|
|Max.5mA ,at 4.1KHz 50% duty Square Wave 5Vp-p|
|4||Sound Output at 10cm||Min 65dB,at 4.1KHz 50% duty Square Wave 3Vp-p|
|Min 70dB,at 4.1KHz 50% duty Square Wave 5Vp-p|
|5||Capacitance||12000±30%pF at 1KHz|
|8||Net Weight||Approx 0.2g|
2.Dimensions Unit: mm
*Housing Material: Black LCP
*Terminal plate: 2 soldering pads, gold Plating Brass
|3. Electrical And Acoustical Measuring Condition|
a)Ordinary Temperature Life Test
The part shall be subjected to 96 hours at 25±10℃. Input rated voltage Resonant frequency, 1/2 duty Square wave.
b)High Temperature Test
The part shall be capable of with standing a storage temperature of +85℃ for 96 hours.
c)Low Temperature Test
The part shall be capable of with standing a storage temperature of -40℃ for 96 hours.
Temperature:+40℃±3℃ Relative Humidity:90%～95% Duration: 48 hours and expose to room temperature for 6 hours
e)Temperature Shock Test
Temperature:60℃ /1hour→ 25℃/3hours→-20℃/1hour→ 25℃/3hours (1cycle)
Total cycle: 10 cycles
Standard Packaging From 75cm(Drop on hard wood or board of 5cm thick, three sides, six plain.)
(1) No abnormality should be found after reflow
(2) Good soldering to meet soldering requirements
As this product is not protected from foreign material entering, please make sure that any foreign materials (e.g. magnetic powder, washing solvent, flux, corrosive gas) do not enter this product in your production processes. The functional degradation (e.g. SPL down) may occur if foreign material enter it.
6. Surface mounting condition
6.1 Reflow soldering
Recommendable reflow soldering condition is as follows.
Note: (1) In automated mounting of the SMD sound transducers on PCB, any bending, expanding
and pulling forces or shocks against the SMD sound transducers shall be kept minimum
to prevent them from electrical failures and mechanical damages of the devices.
(2) In the reflow soldering, too high soldering temperatures and too large temperature
Gradient such as rapid heating or cooling may cause electrical failures and mechanical
damages of the devices.
6.2 Soldering pattern